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Filp Chip packagingprocess can choose 4-16 layer substrate with ABF and PP that supports , single chip and multi chips packaging solutions. with different ball diameters of 0.76/0.50/0.30/0.40/0.25mm. It is suitable for high-end products such as various VPS Core devices, computing and data processing products .
① Provide co-design and co-simulation service in multiple physical domains such as electricity, heat, stress, and fluid so as to empower product value and shorten R&D cycle;
② ABF scheme supports narrower line width/spacing and high-speed products; PP solution gives higher reliability and meets sinicization requirements.
